Physical vapor deposition of boron nitride
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- Tez No: 836989
- Danışmanlar: DR. DAVİD GRANT
- Tez Türü: Yüksek Lisans
- Konular: Metalurji Mühendisliği, Metallurgical Engineering
- Anahtar Kelimeler: Belirtilmemiş.
- Yıl: 2023
- Dil: İngilizce
- Üniversite: The University of Nottingham
- Enstitü: Yurtdışı Enstitü
- Ana Bilim Dalı: Belirtilmemiş.
- Bilim Dalı: Belirtilmemiş.
- Sayfa Sayısı: 51
Özet
Due to having outstanding mechanical, thermal, and electrical properties, hexagonal (h) and cubic (c) boron nitride (BN) have been used as thin film coatings in harsh conditions. For production of the thin films, PVD techniques have been preferred in industries. Among the PVD techniques, sputtering processes have been chosen because they generally offer relatively higher adhesion and uniformity of the films compared to the evaporating process. h-BN and c-BN depositions have been conducted with either assistance of plasma or ion mostly. In these depositions, temperatures were generally high for nucleation and growth of the film. In this thesis, extensive literature review was conducted on BN and deposition of its films by PVD. As the experimental aspect of the project, the possibility of deposition of BN films by plasma assisted magnetron sputtering at low temperatures was examined by literature review and laboratory studies. To improve the adhesion of the films, interlayers were deposited between BN films and copper substrate. Interlayers consisted of BCN, CrC and Cr. BN films were deposited at two different temperatures as, namely 300 oC and 400 oC. The effect of deposition temperature on the composition and adhesion of the films was investigated by Fourier transform infrared (FTIR) analysis, pull-off adhesion, and scratch tests. For lower temperature deposited film, c-BN content was 36% and higher than samples that were deposited at 400 oC. However, more uniformity was obtained in higher temperature films. The pull-off adhesion tests revealed-higher failure strengths of 72.5 MPa for the higher temperature samples. Both films demonstrated partial film delamination against the pull-off adhesion test. For the scratch tests, a similar situation was observed. When complete delamination load values compared each other, higher temperature samples failed at faintly higher loads as 16.3 N.
Özet (Çeviri)
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