Measurement of thermal conductivity of semiconductor material
Başlık çevirisi mevcut değil.
- Tez No: 402468
- Danışmanlar: PROF. REBECCA CHEUNG
- Tez Türü: Yüksek Lisans
- Konular: Endüstri ve Endüstri Mühendisliği, Endüstri Ürünleri Tasarımı, Industrial and Industrial Engineering, Industrial Design
- Anahtar Kelimeler: Belirtilmemiş.
- Yıl: 2010
- Dil: İngilizce
- Üniversite: The Unıversıty Of Edınburgh
- Enstitü: Yurtdışı Enstitü
- Ana Bilim Dalı: Belirtilmemiş.
- Bilim Dalı: Belirtilmemiş.
- Sayfa Sayısı: Belirtilmemiş.
Özet
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Özet (Çeviri)
The project will compare different techniques for measuring thermal conductivity by using microstructures and a simple macroscopic method. Microelectromechanical Systems (MEMS) applications are used for a wide range of purposes, from bio-sciences to displays or optical applications, which leads to a constant demand for different materials for use in sensors, valves and actuators. New materials must be tested to investigate their thermal properties in order to be used in areas such as sensing, packaging and aerospace applications where materials with high thermal conductivity are required. Lee's Disk is the set up used for the macroscopic measuring method. A number of samples with known thermal conductivities were used to analyse the limitations of the Lee's Disk method. Factors such as the number of significant figures of the measurement equipment, dimensions and thermal characteristics of the sample become very important when deducing thermal conductivity. The report will evaluate this technique and its limitations. Thermal conductivity of thin films is expected to be significantly different than materials in bulk. Therefore, it is of utmost importance that microstructures are used to measure thermal conductivity of thin films. At this stage only one structure has been attempted. The structure utilises one reference and one test structure, which are identical except that the test structure has a heat sink. I-V characteristics of the structures will be evaluated to work out the thermal conductivity of sample. The fabrication process of the structure is explored in detail. Several different material such as Titanium, Tantalum, doped polysilicon will be analysed using this method. The structures which have successfully been fabricated have been tested to yield results which will be analysed in this report. The report also contains a literature review, showing different resources and papers which have been studied.
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