Katodik Ark Pvd yöntemi ile üretilmiş tiaın ve tin kaplamalarının korozyon özellikleri
Başlık çevirisi mevcut değil.
- Tez No: 46409
- Danışmanlar: PROF.DR. ALİ FUAT ÇAKIR
- Tez Türü: Yüksek Lisans
- Konular: Metalurji Mühendisliği, Metallurgical Engineering
- Anahtar Kelimeler: Belirtilmemiş.
- Yıl: 1995
- Dil: Türkçe
- Üniversite: İstanbul Teknik Üniversitesi
- Enstitü: Fen Bilimleri Enstitüsü
- Ana Bilim Dalı: Belirtilmemiş.
- Bilim Dalı: Belirtilmemiş.
- Sayfa Sayısı: 45
Özet
PVD processes can be divided into three groups based on different mechanisms in bringing material, to be coated, to vapour phase. These PVD processes are evaporation, sputtering and ion plating. Evaporation is the oldest and the most known PVD method. The basic evaporation process involves the transfer of material to form a coating by vaporization. Unlike the other vapor depotion processes, evaporation is a low energy process with particle energy averaging 0.2 to 0.3 eV. The disadvantages of this method are non uniform coverage and relatively low adhesion. Evaporation is very successful! in applications where adhesion and good structure are not critical such as decorative and optical uses. Evaporation is not used for critical corrosion applications. Sputtering is a process wherein material is ejected from surface of source material by bombardment with energetic particles. The bombarding species are generally ions of heavy inert gas such as argon. Sputtering can be used as a method of surface cleaning or coating. Sputtered atoms are transported to substrate with energies of 10 to 40 eV. Sputtering have been developed in the semiconductor industry in the"! 970' s. Two original primary disadvantages, nonuniform coverage and low deposition rate have been largely overcame by using magretron technique. One of the biggest advantages iş that magnetron sputtering process can be operated at temperatures as low as 180°C, allowing the use of polymers and composites possible as substrate. Ion plating is actually a hybrid concept based on the evaporation or sputtering mechanism coupled with a glow discharge. Glow discharge can be formed between certain gas pressure at high voltages. There are three possible deposition systems: resistance evaporation, electron beam evaporation and sputtering. All three systems generate a plasma by glow discharge resulting a large increasing on the energy of the deposition species. Deposition species in ion plating have higher energy than those of evaporation or sputtering process. This results in improved adhesion. Low voltage electron beam evaporation ( Balzers process) is an ion plating process which use an electron gun to heat target to be coated. In this process, argon gas is introduced into the chamber to forms a plasma glow. The deposition of ternary nitrides is not possible because of target materials with different melting point can not be evaporated simultaneouesly. Sputter ion plating is a glow discharge sputtering process. In addition to basic sputtering process, in this process a glow disharge which increase ionization degree VII
Özet (Çeviri)
THE CORROSION PROPERTIES OF TSAIN AND TiN COATINGS DEPOSITED ON CARBON STEEL BY CATHODIC ARC PVD METHOD SUMMARY Metals are protected with metallic ör ceramic coatings tor öne ör more of following reasons: 1.to prevent ör to reduce corrosion of the substrate material. 2.to improve the physical ör mechanical properties of the substrate material. 3.to give desired decorative apperance The choice of substrate materiai is usually governed by cost, weight and general physical, mechanical and manufacturing properties. Chosen material often does not have ideal wear and corrosion resistivity in service conditiions. Coating improves chemical and physical performance of the substrate. Ceramic coatings have been successfull and widely used on cutting tools where wear is critical due to its refractory properties. The group 4b nitrides with their gold like colors have generated a great deal of interest as economical, hard, scratch and wear resistant ceramic coatings. Among these TiN films has governed especially the cutting tool industry due to good protection against wear. Among PVD thin ceramic coatings TiN films are mostly used to improve the performance of cutting tools for turning, drilling, tapping and milling operations. Vapor deposited coatings are not only used in the cutting industry but also the other areas including optical, electrical, electronic, chemical and decorative applications. These coatings are extensiveiy used on glass frame as optical and decorative functions, on watchs and otomotive parts as decorative function, on capacitors as electronical function, on cutting tools as mechanical function and in manufacturing corrosion resistant parts. Thin ceramic filrns based on carbides, nitrides and borides of transition metals are generally produced by physical vapour deposition methods. PVD methods have capability to deposit refractory materials as thin films and to coat uniformly complex shaped parts at high deposition rates. viPVD processes can be divided into three groups based on different mechanisms in bringing material, to be coated, to vapour phase. These PVD processes are evaporation, sputtering and ion plating. Evaporation is the oldest and the most known PVD method. The basic evaporation process involves the transfer of material to form a coating by vaporization. Unlike the other vapor depotion processes, evaporation is a low energy process with particle energy averaging 0.2 to 0.3 eV. The disadvantages of this method are non uniform coverage and relatively low adhesion. Evaporation is very successful! in applications where adhesion and good structure are not critical such as decorative and optical uses. Evaporation is not used for critical corrosion applications. Sputtering is a process wherein material is ejected from surface of source material by bombardment with energetic particles. The bombarding species are generally ions of heavy inert gas such as argon. Sputtering can be used as a method of surface cleaning or coating. Sputtered atoms are transported to substrate with energies of 10 to 40 eV. Sputtering have been developed in the semiconductor industry in the"! 970' s. Two original primary disadvantages, nonuniform coverage and low deposition rate have been largely overcame by using magretron technique. One of the biggest advantages iş that magnetron sputtering process can be operated at temperatures as low as 180°C, allowing the use of polymers and composites possible as substrate. Ion plating is actually a hybrid concept based on the evaporation or sputtering mechanism coupled with a glow discharge. Glow discharge can be formed between certain gas pressure at high voltages. There are three possible deposition systems: resistance evaporation, electron beam evaporation and sputtering. All three systems generate a plasma by glow discharge resulting a large increasing on the energy of the deposition species. Deposition species in ion plating have higher energy than those of evaporation or sputtering process. This results in improved adhesion. Low voltage electron beam evaporation ( Balzers process) is an ion plating process which use an electron gun to heat target to be coated. In this process, argon gas is introduced into the chamber to forms a plasma glow. The deposition of ternary nitrides is not possible because of target materials with different melting point can not be evaporated simultaneouesly. Sputter ion plating is a glow discharge sputtering process. In addition to basic sputtering process, in this process a glow disharge which increase ionization degree VIIis formed and this results in increasing particle energy. Sputtered coatings are more columnar than LVEB or arc ion plated coatings. In arc ion plating, the evaporated species are produced directly from solid phase with the aid of an electric arc striking the cathode target. PVD by cathodic arc evaporation is often preffered for its low substrate temperature, good target economy, high deposition rate and high ionization grade. Cathodic arc plasma deposition process have a much higher degree ionization than those of the other ion plating processes. This results in film with superior bonding to the substrate and high film density. Synthesis of nitrides or borides involve an arc evaporation of the metal such as titanium, hafnium etc. in the reactive nitrogen gas. Due to its high ionization degrees carbides and oxides especially AI2O3 can be deposited by cathodic arc ion plating process. One of main characteristic of arc evaporation is macroparticle which are generated by the action of the cathode spots. Coatings with significant macroparticles have a surface roughness and matt apperance. Applications where macroparticle would clearly be detrimental include optical and microelectronic coatings. In order to reduce the generation of macroparticle is necessary to reduce the cathode temperature or to use steered arc deposition technique and to filter macroparticles from plasma by using low angle collectors and increasing substrate bias voltage. The most extensively researched application of arc deposited coatings is in the area of wear resistant coatings on cutting and forming tools. Cathodic arc technique recently enters to the corrosion resistant coatings. Potential applications for arc deposited coatings may be in the area of aerospace industry. Cathodic arc technology is in the early stages of decorative coating areas. The flexibility of the process, its capability to deposit metals and coatings at high rates and qualities of deposited film make cathodic arc a very attractive alternative for decorative work. Cathodic arc method provides deposition rates of several micrometers per minute when depositing pure metals or alloys. As a consequence, cathodic arc makes many applications economically feasible. With appropriate source and process developments to eleminate microdroplets, applications of the arc process will be extended to the areas of magnetic and optical disc, hybrid circuit and flexible circuit. TiN coatings have been successfull in cutting tool industry. But TiN coatings has given less satisfactory results when used to machine nickel based super alloys, titanium and its alloys, stainless steels and cast irons. As a consequence of high cutting speed needed to machine these materials, TiAIN coatings with high oxidation resistance are substituting TiN coatings. Introduction of aluminium to TiN films is to VIllimprove the oxidation behaviour of the coated system. While oxidation temperature of TiAIN coatings is over 750 °C, TiN coatings begins to oxidize at 300-400°C. The reason of high oxidation resistance of TiAIN coatings is the formation of protective refractory AI2O3 film at high temperatures. However, TiN coatings have better performance than that of TiAIN coatings in machining ordinary steel. The microstructure of TiN and TiAIN films depend on the coating parameters such as deposition temperature, nitrogen pressure and bias voltage. Coatings with zone T microstructurel are most dense. Coatings with this microstructre are correct for wear and corrosion resistant coating. While TiN coatings have very attractive golden yellow color, Introduction of aluminium to TiN coatings shifts color from yellow to brown. Adhesion of films to the substrate have major important in related to coating performance in wear applications. TiN coatings have a good adhesion properties. Addition of aluminium to TiN films affects adhesion properties in negative way. TiN ve TiAIN coatings are prefered in cutting industry due to high hardness values. TiAIN coatings are harder than TiN coatings. Increase in aluminium content of TiAIN film increases hardness. Coatings are often used to improve the corrosion resistance of substrate. Theoretically, a coating isolates a substrate from the environment and is responsible of the electrochemical behaviour of the coated system. The corrosion behaviour of PVD coatings depend upon defect in coating. However, thin film coatings always include structural defects such as pores and cracks that expose the substrate to the environment. The quality of cathodic coatings is always inversly proportional to the porosity. Porosity and its detrimental effects are decreased by intermediate layers, passivation and greater coatin thickness, increase in coating thickness may cause inner tension of the coating, which may lead to cracking. In this study, in order to evaluate and to compare the corrosion behaviour of TiAIN and TiN coated 1040 carbon steel substrate, decoration and electrochemical experiments were carried out. In addition these, hardness of both coatings were measured with fischerscope H'100 XYPROG microhardness testing system and thickness of both coatings with wirtz buchler calotester.were determined. The results of decoration experiments show that TiAIN coatings contain less porosity than that of TiN coatings. IXThe electrochemical impedance and polarization experiments show that TiAIN coatings have highest polarization resistance and lowest corrosion current density. These means that TiAIN coatings are more successfull in isolating substrate than that of TiN coatings. TiAIN coating was a multilayer (TiN and TiAIN ) and TiN was a single layer coating. Total number of layers from investigation of the trace of calotester disc were determined as six. Three of six layers was TiN. Hardness values determined by microhardness testing system were 3400 HVN for TiAIN film and 2900 HVN for TiN
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